MSP430F2272IDAR
vs
MSP430F2272TDAQ1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
TSSOP
|
|
Package Description |
GREEN, PLASTIC, TSSOP-38
|
TSSOP, TSSOP38,.32
|
Pin Count |
38
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Has ADC |
YES
|
|
Additional Feature |
ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ
|
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
|
CPU Family |
MSP430
|
MSP430
|
Clock Frequency-Max |
16 MHz
|
|
DAC Channels |
NO
|
|
DMA Channels |
NO
|
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-PDSO-G38
|
R-PDSO-G38
|
JESD-609 Code |
e4
|
|
Length |
12.5 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
2
|
|
Number of DMA Channels |
|
|
Number of I/O Lines |
32
|
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
38
|
38
|
Number of Timers |
6
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP38,.32
|
TSSOP38,.32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
1024
|
RAM (words) |
1
|
|
ROM (words) |
33024
|
32768
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.2 mm
|
|
Speed |
16 MHz
|
16 MHz
|
Supply Current-Max |
0.55 mA
|
0.55 mA
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
2.2 V
|
|
Supply Voltage-Nom |
2.2 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
6.1 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare MSP430F2272IDAR with alternatives
Compare MSP430F2272TDAQ1 with alternatives