MSP430F2618TGQWTEP
vs
MSP430F2618TGQW
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-113
|
VFBGA,
|
Pin Count |
113
|
113
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ
|
ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
|
CPU Family |
MSP430
|
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PBGA-B113
|
S-PBGA-B113
|
JESD-609 Code |
e0
|
|
Length |
7 mm
|
7 mm
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of DMA Channels |
3
|
|
Number of External Interrupts |
|
|
Number of I/O Lines |
64
|
64
|
Number of Serial I/Os |
4
|
|
Number of Terminals |
113
|
113
|
Number of Timers |
10
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA113,12X12,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
235
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
8192
|
|
ROM (words) |
118784
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1 mm
|
Speed |
16 MHz
|
16 MHz
|
Supply Current-Max |
0.595 mA
|
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.7 V
|
2.2 V
|
Supply Voltage-Nom |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
7 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MSP430F2618TGQWTEP with alternatives
Compare MSP430F2618TGQW with alternatives