MSP430F5309IRGC
vs
MSP430F5509IZQE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
HVQCCN,
|
BGA-80
|
| Pin Count |
64
|
80
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
|
OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
16
|
16
|
| Clock Frequency-Max |
32 MHz
|
32 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-PBGA-B80
|
| Length |
9 mm
|
5 mm
|
| Number of I/O Lines |
47
|
47
|
| Number of Terminals |
64
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.4 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
9 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Boundary Scan |
|
YES
|
| CPU Family |
|
MSP430
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e1
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of DMA Channels |
|
3
|
| Number of External Interrupts |
|
|
| Number of Serial I/Os |
|
4
|
| Number of Timers |
|
18
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
BGA80,9X9,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
4096
|
| RAM (words) |
|
4
|
| ROM (words) |
|
24576
|
| Supply Current-Max |
|
7 mA
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MSP430F5309IRGC with alternatives
Compare MSP430F5509IZQE with alternatives