MSP430G2211IRSAQ1
vs
MSP430G2211IPW4RQ1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC16,.16SQ,25
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ
|
|
| Address Bus Width |
|
|
| Bit Size |
16
|
16
|
| CPU Family |
MSP430
|
MSP430
|
| Clock Frequency-Max |
0.05 MHz
|
0.032 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N16
|
R-PDSO-G14
|
| Length |
4 mm
|
5 mm
|
| Number of I/O Lines |
10
|
10
|
| Number of Terminals |
16
|
14
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC16,.16SQ,25
|
TSSOP14,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
128
|
128
|
| ROM (words) |
2048
|
2048
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Current-Max |
0.37 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Boundary Scan |
|
YES
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e4
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Number of Timers |
|
1
|
| On Chip Data RAM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Voltage-Nom |
|
2.2 V
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MSP430G2211IRSAQ1 with alternatives
Compare MSP430G2211IPW4RQ1 with alternatives