MT28C256532W18DFT-F605P70BTWT vs M36LLR8760M1ZAQE feature comparison

MT28C256532W18DFT-F605P70BTWT Micron Technology Inc

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M36LLR8760M1ZAQE Numonyx Memory Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC NUMONYX
Part Package Code BGA BGA
Package Description LFBGA, LFBGA,
Pin Count 88 88
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e1 e1
Length 12 mm 10 mm
Memory Density 134217728 bit 268435456 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 16777216 words
Number of Words Code 8000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 8 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Supply Voltage-Nom (Vsup) 1.8 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare M36LLR8760M1ZAQE with alternatives