MT58L512V18FQ-8.8
vs
MCM63Z918TQ7
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP,
|
QFP,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
7.5 ns
|
7 ns
|
| Additional Feature |
AUTOMATIC POWER DOWN
|
FLOW-THROUGH OR PIPELINED ARCHTECTURE
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
22 mm
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
STANDARD SRAM
|
ZBT SRAM
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
512KX18
|
512KX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
2.4 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
4
|
|
|
|