MT58L64L32PT-6 vs AS7C3364NTD32B-200TQC feature comparison

MT58L64L32PT-6 Micron Technology Inc

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AS7C3364NTD32B-200TQC Alliance Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC ALLIANCE SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description PLASTIC, MS-026BHA, TQFP-100 LQFP,
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 3 ns
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX32 64KX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.34 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 3 2
Additional Feature PIPELINED ARCHITECTURE

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