MT58V2MV18FF-7.5
vs
AS7C33128NTD36A-200BC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
ALLIANCE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
QFP
|
Package Description |
TBGA,
|
LQFP,
|
Pin Count |
165
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
7.5 ns
|
|
Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
|
JESD-30 Code |
R-PBGA-B165
|
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
|
Memory Density |
37748736 bit
|
|
Memory IC Type |
STANDARD SRAM
|
|
Memory Width |
18
|
|
Number of Functions |
1
|
|
Number of Terminals |
165
|
|
Number of Words |
2097152 words
|
|
Number of Words Code |
2000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
2MX18
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TBGA
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
2.625 V
|
|
Supply Voltage-Min (Vsup) |
2.375 V
|
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
15 mm
|
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
No
|
|
|
|
Compare MT58V2MV18FF-7.5 with alternatives
Compare AS7C33128NTD36A-200BC with alternatives