MT58V2MV18FF-7.5
vs
CXK77N36R160GB-3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
SONY CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TBGA,
|
BGA, BGA119,7X17,50
|
| Pin Count |
165
|
119
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
1.5 ns
|
| Additional Feature |
|
IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY
|
| Clock Frequency-Max (fCLK) |
|
333 MHz
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PBGA-B119
|
| JESD-609 Code |
|
e0
|
| Length |
|
22 mm
|
| Memory Density |
|
18874368 bit
|
| Memory IC Type |
|
LATE-WRITE SRAM
|
| Memory Width |
|
36
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
119
|
| Number of Words |
|
524288 words
|
| Number of Words Code |
|
512000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
512KX36
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA119,7X17,50
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.4 mm
|
| Standby Current-Max |
|
0.16 A
|
| Standby Voltage-Min |
|
1.7 V
|
| Supply Current-Max |
|
0.55 mA
|
| Supply Voltage-Max (Vsup) |
|
2.63 V
|
| Supply Voltage-Min (Vsup) |
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
14 mm
|
|
|
|
Compare MT58V2MV18FF-7.5 with alternatives
Compare CXK77N36R160GB-3 with alternatives