MT58V2MV18FF-7.5
vs
CY7C1383AV25-100AC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
TBGA,
|
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
|
| Pin Count |
165
|
100
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
8.5 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PQFP-G100
|
| JESD-609 Code |
|
e0
|
| Length |
|
20 mm
|
| Memory Density |
|
18874368 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
18
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
100
|
| Number of Words |
|
1048576 words
|
| Number of Words Code |
|
1000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
1MX18
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LQFP
|
| Package Equivalence Code |
|
QFP100,.63X.87
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.6 mm
|
| Standby Current-Max |
|
0.015 A
|
| Standby Voltage-Min |
|
2.38 V
|
| Supply Current-Max |
|
0.23 mA
|
| Supply Voltage-Max (Vsup) |
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
14 mm
|
|
|
|
Compare MT58V2MV18FF-7.5 with alternatives
Compare CY7C1383AV25-100AC with alternatives