MT58V2MV18FF-7.5
vs
71V3576YS150BGGI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TBGA,
|
BGA,
|
| Pin Count |
165
|
119
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
7.5 ns
|
3.8 ns
|
| Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B119
|
| JESD-609 Code |
e1
|
e1
|
| Length |
17 mm
|
22 mm
|
| Memory Density |
37748736 bit
|
4718592 bit
|
| Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
| Memory Width |
18
|
36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
119
|
| Number of Words |
2097152 words
|
131072 words
|
| Number of Words Code |
2000000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
2MX18
|
128KX36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.36 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare MT58V2MV18FF-7.5 with alternatives
Compare 71V3576YS150BGGI with alternatives