MT58V2MV18FF-7.5 vs CXK77N36R160GB-3 feature comparison

MT58V2MV18FF-7.5 Micron Technology Inc

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CXK77N36R160GB-3 Sony Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SONY CORP
Part Package Code BGA BGA
Package Description TBGA, BGA, BGA119,7X17,50
Pin Count 165 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 1.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e1 e0
Length 17 mm 22 mm
Memory Density 37748736 bit 18874368 bit
Memory IC Type STANDARD SRAM LATE-WRITE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 2097152 words 524288 words
Number of Words Code 2000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 2MX18 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.4 mm
Supply Voltage-Max (Vsup) 2.625 V 2.63 V
Supply Voltage-Min (Vsup) 2.375 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.16 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.55 mA

Compare MT58V2MV18FF-7.5 with alternatives

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