MT58V2MV18FF-7.5 vs CY7C1345B-50AC feature comparison

MT58V2MV18FF-7.5 Micron Technology Inc

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CY7C1345B-50AC Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description TBGA, LQFP,
Pin Count 165 100
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 11 ns
Additional Feature FLOW-THROUGH ARCHITECTURE SELF-TIMED WRITE
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e1 e0
Length 17 mm 20 mm
Memory Density 37748736 bit 4718592 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 2097152 words 131072 words
Number of Words Code 2000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX18 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.625 V 3.6 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 15 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Moisture Sensitivity Level 3

Compare MT58V2MV18FF-7.5 with alternatives

Compare CY7C1345B-50AC with alternatives