MT9172AN1
vs
MH89726
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
ZARLINK SEMICONDUCTOR INC
|
Part Package Code |
SSOP
|
|
Package Description |
5.30 MM WIDTH, LEAD FREE, MO-150AG, SSOP-24
|
SIP, SIP10,.2
|
Pin Count |
24
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
JESD-30 Code |
R-PDSO-G24
|
R-XSIP-T10
|
JESD-609 Code |
e3
|
e0
|
Length |
8.2 mm
|
25.4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
10
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SSOP
|
SIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
10.29 mm
|
Supply Voltage-Nom |
5 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
HYBRID
|
Telecom IC Type |
DIGITAL SLIC
|
ISDN LOOP EXTENDER CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
SINGLE
|
Width |
5.3 mm
|
3.56 mm
|
Base Number Matches |
3
|
2
|
Neg Supply Voltage-Nom |
|
-15 V
|
Package Equivalence Code |
|
SIP10,.2
|
|
|
|
Compare MT9172AN1 with alternatives
Compare MH89726 with alternatives