MX1N5257BTR vs 1N5937B3P-TP feature comparison

MX1N5257BTR Microsemi Corporation

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1N5937B3P-TP Micro Commercial Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICRO COMMERCIAL COMPONENTS CORP
Part Package Code DO-7
Package Description HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count 2
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2
JESD-609 Code e0 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.417 W 3 W
Qualification Status Not Qualified
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE
Terminal Position AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 11.4 mA
Base Number Matches 2 2
Samacsys Manufacturer MCC
Dynamic Impedance-Max 33 Ω
Knee Impedance-Max 800 Ω
Peak Reflow Temperature (Cel) 260
Reverse Current-Max 0.001 µA
Time@Peak Reflow Temperature-Max (s) 10

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