MX23C1610MC-10 vs K3P5C1000D-GC100 feature comparison

MX23C1610MC-10 Macronix International Co Ltd

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K3P5C1000D-GC100 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description SOP, SOP44,.63 SOP,
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0
Length 28.5 mm 28.5 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP44,.63
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 3.1 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.06 mA 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 12.6 mm 12.6 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

Compare MX23C1610MC-10 with alternatives

Compare K3P5C1000D-GC100 with alternatives