N74F51N vs MC54F51JD feature comparison

N74F51N NXP Semiconductors

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MC54F51JD Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-14 DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ASYMMETRICAL INPUTS ASYMMETRICAL I/P'S
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e4
Length 19.025 mm 19.495 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Number of Functions 2 2
Number of Inputs 6 6
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 7.5 mA 7.5 mA
Propagation Delay (tpd) 4.5 ns 5.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1

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