N74LVC10PW
vs
74LVC10APW
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Package Description |
TSSOP,
|
TSSOP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
5 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
3
|
3
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
6.4 ns
|
12.9 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
4
|
3
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
1996-02-01
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP14,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.04 mA
|
| Prop. Delay@Nom-Sup |
|
12.9 ns
|
| Schmitt Trigger |
|
NO
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare N74LVC10PW with alternatives
Compare 74LVC10APW with alternatives