NC7SZ11L6X vs HD74LV1GW04ACME feature comparison

NC7SZ11L6X Fairchild Semiconductor Corporation

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HD74LV1GW04ACME Renesas Electronics Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP RENESAS ELECTRONICS CORP
Part Package Code MicroPak SOIC
Package Description 1 MM, MICROPAK-6 TSSOP, TSSOP6,.08
Pin Count 6 6
Manufacturer Package Code 6LD, MICROPAK, JEDEC MO-252,1.0MM WIDE (Logic style X overs)
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LV/LV-A/LVX/H
JESD-30 Code R-XDSO-N6 R-PDSO-G6
JESD-609 Code e4 e6
Length 1.45 mm 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE INVERTER
Max I(ol) 0.024 A 0.006 A
Moisture Sensitivity Level 1
Number of Functions 1 2
Number of Inputs 3 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9 ns 12 ns
Propagation Delay (tpd) 19 ns 36 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.55 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL GOLD TIN BISMUTH
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1 mm 1.25 mm
Base Number Matches 3 1

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