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NC7WZ17P6_NL vs 74LVC2G07GV,125 feature comparison

NC7WZ17P6_NL Fairchild Semiconductor Corporation

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74LVC2G07GV,125 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code SOIC TSOP
Package Description 1.25 MM, LEAD FREE, EIAJ, SC-88, SC-70, 6 PIN PLASTIC, SC-74, SOT-457, TSOP-6
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 15.8 ns 8.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.5 mm
Base Number Matches 1 2
Rohs Code Yes
Manufacturer Package Code SOT457
Factory Lead Time 4 Weeks
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Package Equivalence Code TSOP6,.11,37
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 4.7 ns
Schmitt Trigger NO
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Logic » Gates
Logic » Gates

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