NCV1455BDR2 vs ICM7555ID/01,112 feature comparison

NCV1455BDR2 Rochester Electronics LLC

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ICM7555ID/01,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code unknown unknown
Analog IC - Other Type PULSE; RECTANGULAR PULSE
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e4
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Manufacturer Package Code SOT96-1
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Moisture Sensitivity Level 1
Output Frequency-Max 0.5 MHz
Package Equivalence Code SOP8,.25

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