NJM4558D
vs
TL082CPT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NISSHINBO MICRO DEVICES INC
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Nisshinbo
|
STMicroelectronics
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
0.02 µA
|
| Bias Current-Max (IIB) @25C |
0.5 µA
|
0.0004 µA
|
| Common-mode Reject Ratio-Min |
70 dB
|
|
| Common-mode Reject Ratio-Nom |
90 dB
|
86 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
6000 µV
|
13000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e6
|
e4
|
| Length |
8.8 mm
|
4.4 mm
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
1.2 mm
|
| Slew Rate-Nom |
1 V/us
|
16 V/us
|
| Supply Current-Max |
5.7 mA
|
5 mA
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN BISMUTH
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
3000
|
4000
|
| Voltage Gain-Min |
19952.6
|
15000
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
ROHS COMPLIANT, TSSOP-8
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Factory Lead Time |
|
16 Weeks, 3 Days
|
| Input Offset Current-Max (IIO) |
|
0.0001 µA
|
| Low-Bias |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Slew Rate-Min |
|
8 V/us
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NJM4558D with alternatives
Compare TL082CPT with alternatives