NL17SG34CMUTCG
vs
NL17SG34DTT1G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
| Part Package Code |
DFN
|
|
| Package Description |
VSON, SOLCC6,.04,14
|
TSSOP, TSOP5/6,.11,37
|
| Pin Count |
6
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
17SG
|
17SG
|
| JESD-30 Code |
S-PDSO-N6
|
R-PDSO-G5
|
| Length |
1 mm
|
3 mm
|
| Load Capacitance (CL) |
30 pF
|
30 pF
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Max I(ol) |
0.008 A
|
0.008 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC6,.04,14
|
TSOP5/6,.11,37
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
20 mA
|
20 mA
|
| Prop. Delay@Nom-Sup |
4.8 ns
|
4.8 ns
|
| Propagation Delay (tpd) |
22.4 ns
|
22.4 ns
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
0.55 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL GOLD PALLADIUM
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.35 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1 mm
|
1.5 mm
|
| Base Number Matches |
1
|
1
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare NL17SG34CMUTCG with alternatives
Compare NL17SG34DTT1G with alternatives