NLAS4599DTT1
vs
NLAS4599DFT2
feature comparison
Pbfree Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
TSOP-6
|
SC-88/SC70-6/SOT-363 6 LEAD
|
Package Description |
TSOP-6
|
SC-70, SOT-323, SC-88, 6 PIN
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
318G-02
|
419B-02
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
onsemi
|
onsemi
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e0
|
e0
|
Length |
3 mm
|
2 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Off-state Isolation-Nom |
93 dB
|
93 dB
|
On-state Resistance Match-Nom |
3 Ω
|
3 Ω
|
On-state Resistance-Max (Ron) |
40 Ω
|
40 Ω
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSOP6,.11,37
|
TSSOP6,.08
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
235
|
235
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
15 ns
|
15 ns
|
Switch-on Time-Max |
30 ns
|
30 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn80Pb20)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
1.5 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
|
|
|