NLAS5223LMNR2G
vs
NLAS4685FCT1G
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFN
|
BCC
|
Package Description |
1.40 X 1.80 MM, 0.75 MM HEIGHT, 0.40 MM PITCH, LEAD FREE, WQFN-10
|
MICROBUMP-10
|
Pin Count |
10
|
10
|
Reach Compliance Code |
unknown
|
unknown
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-XQCC-N10
|
R-PBGA-B10
|
JESD-609 Code |
e4
|
e3
|
Length |
1.8 mm
|
1.965 mm
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
Number of Channels |
1
|
1
|
Number of Functions |
2
|
1
|
Number of Terminals |
10
|
10
|
Off-state Isolation-Nom |
65 dB
|
65 dB
|
On-state Resistance Match-Nom |
0.05 Ω
|
0.06 Ω
|
On-state Resistance-Max (Ron) |
0.3 Ω
|
1 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Seated Height-Max |
0.8 mm
|
0.65 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
30 ns
|
60 ns
|
Switch-on Time-Max |
50 ns
|
60 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
1.4 mm
|
1.465 mm
|
Base Number Matches |
2
|
2
|
Manufacturer Package Code |
|
MICROBUMP
|
|
|
|
Compare NLAS5223LMNR2G with alternatives
Compare NLAS4685FCT1G with alternatives