NLVHC1GT66MUR2G
vs
MC74VHC1GT66DFT1G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ON SEMICONDUCTOR
|
| Part Package Code |
DFN
|
SOT-353
|
| Package Description |
1.20 X 1.00 MM, 0.40 PITCH, LEAD FREE, UDFN-6
|
TSSOP,
|
| Pin Count |
6
|
5
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
|
| Length |
1.2 mm
|
2 mm
|
| Normal Position |
NO
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Off-state Isolation-Nom |
80 dB
|
80 dB
|
| On-state Resistance-Max (Ron) |
60 Ω
|
60 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC6,.04,16
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.55 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
50 ns
|
50 ns
|
| Switch-on Time-Max |
50 ns
|
50 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare NLVHC1GT66MUR2G with alternatives
Compare MC74VHC1GT66DFT1G with alternatives