NMC27C256Q200 vs AM27256-2DEB feature comparison

NMC27C256Q200 National Semiconductor Corporation

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AM27256-2DEB AMD

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Package Description WINDOWED, CERAMIC, DIP-28 WDIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 200 ns 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 13 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 5.588 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 1
Part Package Code DIP
Pin Count 28
Length 37.1475 mm

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Compare AM27256-2DEB with alternatives