NMC27C32BQ250 vs NMC27C32BQE250 feature comparison

NMC27C32BQ250 National Semiconductor Corporation

Buy Now Datasheet

NMC27C32BQE250 National Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description WDIP, DIP24,.6 WDIP, DIP24,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
Additional Feature TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX8 4KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.969 mm 5.715 mm
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.02 mA 0.02 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1

Compare NMC27C32BQ250 with alternatives

Compare NMC27C32BQE250 with alternatives