NMC27C32BQ250 vs AM2732BDC feature comparison

NMC27C32BQ250 Fairchild Semiconductor Corporation

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AM2732BDC Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP24,.6 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
I/O Type COMMON
JESD-30 Code R-XDIP-T24 R-GDIP-T24
JESD-609 Code e0
Memory Density 32768 bit 32768 bit
Memory Width 8 8
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX8 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA 0.1 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Length 32.0675 mm
Memory IC Type UVPROM
Number of Functions 1
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Seated Height-Max 5.588 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Width 15.24 mm