NTS0101GW,125
vs
LU82562V
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEL CORP
|
| Part Package Code |
TSSOP
|
BGA
|
| Package Description |
PLASTIC, SOT363, SC-88
|
BGA,
|
| Pin Count |
6
|
81
|
| Manufacturer Package Code |
SOT363
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
R-PDSO-G6
|
S-PBGA-B81
|
| JESD-609 Code |
e3
|
e1
|
| Length |
2 mm
|
10 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
81
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
BGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
1.815 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
OTHER
|
| Terminal Finish |
Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.25 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare NTS0101GW,125 with alternatives
-
NTS0101GW,125 vs SKY65208
-
NTS0101GW,125 vs SKY65204
-
NTS0101GW,125 vs 1894K-33LFT
-
NTS0101GW,125 vs 935293623125
-
NTS0101GW,125 vs NTS0101GM,115
-
NTS0101GW,125 vs 1894K-43LF
-
NTS0101GW,125 vs NCN5121MNTWG
-
NTS0101GW,125 vs MU9C8338-TFI
-
NTS0101GW,125 vs NCN5130MNTWG
Compare LU82562V with alternatives