NTS0101GW,125
vs
MAX33053EASA+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Part Package Code |
TSSOP
|
8-SOIC_N-150_MIL
|
| Package Description |
PLASTIC, SOT363, SC-88
|
|
| Pin Count |
6
|
8
|
| Manufacturer Package Code |
SOT363
|
8-SOIC_N-150_MIL
|
| Reach Compliance Code |
compliant
|
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
NXP
|
Analog Devices
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.25 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2018-08-23
|
|
|
|
Compare NTS0101GW,125 with alternatives
Compare MAX33053EASA+T with alternatives