NTS0101GW,125
vs
MCP2022A-330E/P
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
TSSOP
|
|
Package Description |
PLASTIC, SOT363, SC-88
|
DIP,
|
Pin Count |
6
|
|
Manufacturer Package Code |
SOT363
|
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
R-PDSO-G6
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
2 mm
|
9.271 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.1 mm
|
5.334 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
NO
|
Telecom IC Type |
INTERFACE CIRCUIT
|
CAN TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.25 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Screening Level |
|
TS 16949
|
|
|
|
Compare NTS0101GW,125 with alternatives
Compare MCP2022A-330E/P with alternatives