NVT2002DP
vs
NVT2002GD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SON
|
| Package Description |
TSSOP,
|
VSON, SOLCC8,.12,20
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
Also Required Vref(B) Supply 1.8 to 5.5V
|
| Delay-Max |
|
1.5 ns
|
| Input Characteristics |
|
STANDARD
|
| Interface IC Type |
|
VOLTAGE LEVEL TRANSLATOR
|
| JESD-30 Code |
|
R-PDSO-N8
|
| JESD-609 Code |
|
e4
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
2
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Latch or Register |
|
NONE
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VSON
|
| Package Equivalence Code |
|
SOLCC8,.12,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
0.5 mm
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
1 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
2 mm
|
|
|
|
Compare NVT2002DP with alternatives
Compare NVT2002GD with alternatives