NVT2002DP
vs
TDP2002F
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
| Part Package Code |
SOIC
|
SSOP
|
| Package Description |
TSSOP,
|
SSOP,
|
| Pin Count |
8
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Base Number Matches |
1
|
1
|
| Interface IC Type |
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
|
R-PDSO-G24
|
| Length |
|
13 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
24
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.9 mm
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Supply Voltage-Nom |
|
5 V
|
| Supply Voltage1-Max |
|
25 V
|
| Supply Voltage1-Min |
|
6 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BCDMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
6 mm
|
|
|
|
Compare NVT2002DP with alternatives
Compare TDP2002F with alternatives