NX3L2G384GM
vs
935284499115
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
VQCCN, LCC8,.06SQ,20
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
S-PQCC-N8
|
|
| JESD-609 Code |
e4
|
|
| Length |
1.6 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Off-state Isolation-Nom |
90 dB
|
|
| On-state Resistance Match-Nom |
0.04 Ω
|
|
| On-state Resistance-Max (Ron) |
1.7 Ω
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VQCCN
|
|
| Package Equivalence Code |
LCC8,.06SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.5 mm
|
|
| Supply Voltage-Max (Vsup) |
4.3 V
|
|
| Supply Voltage-Min (Vsup) |
1.4 V
|
|
| Supply Voltage-Nom (Vsup) |
1.65 V
|
|
| Surface Mount |
YES
|
|
| Switch-off Time-Max |
21 ns
|
|
| Switch-on Time-Max |
48 ns
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.6 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare NX3L2G384GM with alternatives
Compare 935284499115 with alternatives