OMAP3503ECBB
vs
OMAP3515ECBB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
POPFCBGA-515
|
POPFCBGA-515
|
| Pin Count |
515
|
515
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
5A992.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Address Bus Width |
15
|
15
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
59 MHz
|
59 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| Internal Bus Architecture |
SINGLE
|
SINGLE
|
| JESD-30 Code |
S-PBGA-B515
|
S-PBGA-B515
|
| JESD-609 Code |
e1
|
e1
|
| Length |
12 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
32
|
32
|
| Number of Terminals |
515
|
515
|
| Number of Timers |
15
|
15
|
| On Chip Data RAM Width |
32
|
32
|
| On Chip Program ROM Width |
32
|
32
|
| Operating Temperature-Max |
90 °C
|
90 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA515,28X28,16
|
BGA515,28X28,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
32768
|
32768
|
| ROM Programmability |
MROM
|
MROM
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Speed |
720 MHz
|
720 MHz
|
| Supply Voltage-Max |
1.91 V
|
1.91 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
3
|
2
|
|
|
|
Compare OMAP3503ECBB with alternatives
Compare OMAP3515ECBB with alternatives