OMAP3530DCBB vs AM3703CBCD100 feature comparison

OMAP3530DCBB Texas Instruments

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AM3703CBCD100 Texas Instruments

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Pbfree Code No
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description VFBGA, BGA515,28X28,16 12 X 12 MM, 0.50 MM PITCH, GREEN, PLASTIC, BGA-515
Pin Count 515 515
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 59 MHz 54 MHz
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B515 S-PBGA-B515
JESD-609 Code e1 e1
Length 12 mm 14 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 515 515
Operating Temperature-Max 85 °C 90 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA515,28X28,16 BGA515,26X26,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.9 mm 1 mm
Speed 600 MHz 1000 MHz
Supply Voltage-Max 1.89 V 1.2 V
Supply Voltage-Min 1.71 V 0.9 V
Supply Voltage-Nom 1.8 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 6 1
On Chip Data RAM Width 8
RAM (words) 65536
Supply Current-Max 900 mA

Compare OMAP3530DCBB with alternatives

Compare AM3703CBCD100 with alternatives