OMAP3530DCBBE
vs
OMAP3525DCBB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VFBGA,
|
VFBGA, BGA515,28X28,16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
15
|
26
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
38.4 MHz
|
59 MHz
|
External Data Bus Width |
32
|
16
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B515
|
S-PBGA-B515
|
Length |
12 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
515
|
515
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Speed |
600 MHz
|
600 MHz
|
Supply Voltage-Nom |
1.15 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
515
|
Bit Size |
|
32
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
BGA515,28X28,16
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Voltage-Max |
|
1.89 V
|
Supply Voltage-Min |
|
1.71 V
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare OMAP3530DCBBE with alternatives
Compare OMAP3525DCBB with alternatives