OMAP3530DCUSA vs OMAP3530DCUS72 feature comparison

OMAP3530DCUSA Texas Instruments

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OMAP3530DCUS72 Texas Instruments

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Pbfree Code No No
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description GREEN, PLASTIC, FCBGA-423 GREEN, PLASTIC, FCBGA-423
Pin Count 423 423
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 59 MHz 59 MHz
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B423 S-PBGA-B423
JESD-609 Code e1 e1
Length 16 mm 16 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4 4
Number of Terminals 423 423
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA423,24X24,25 BGA423,24X24,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Speed 600 MHz 720 MHz
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 16 mm 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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Compare OMAP3530DCUS72 with alternatives