OMAP3530ECUSA
vs
OMAP3530ECUS
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Pin Count |
423
|
423
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PBGA-B423
|
S-PBGA-B423
|
JESD-609 Code |
e1
|
e1
|
Length |
16 mm
|
16 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Terminals |
423
|
423
|
Operating Temperature-Max |
105 °C
|
90 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA423,24X24,25
|
BGA423,24X24,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Speed |
720 MHz
|
720 MHz
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
16 mm
|
16 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
3
|
Samacsys Manufacturer |
|
Texas Instruments
|
|
|
|