OMAPL138AZCEA3
vs
OMAPL138ZCEA3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
13 X 13 MM, 0.65 MM PITCH, GREEN, PLASTIC, BGA-361
|
BGA,
|
| Pin Count |
361
|
361
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY
|
ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY
|
| JESD-30 Code |
S-PBGA-B361
|
S-PBGA-B361
|
| JESD-609 Code |
e1
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
361
|
361
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
|
| Barrel Shifter |
|
NO
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
300 MHz
|
| External Data Bus Width |
|
|
| Format |
|
FLOATING POINT
|
| Internal Bus Architecture |
|
MULTIPLE
|
| Low Power Mode |
|
YES
|
|
|
|
Compare OMAPL138AZCEA3 with alternatives
Compare OMAPL138ZCEA3 with alternatives