OMAPL138AZWTA3 vs MSC7119VM1200 feature comparison

OMAPL138AZWTA3 Texas Instruments

Buy Now Datasheet

MSC7119VM1200 NXP Semiconductors

Buy Now
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 16 X 16 MM, 0.80 MM PITCH, GREEN, PLASTIC, BGA-361 LEAD FREE, MAPBGA-400
Pin Count 361
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY
JESD-30 Code S-PBGA-B361 S-PBGA-B400
JESD-609 Code e1 e1
Moisture Sensitivity Level 3 3
Number of Terminals 361 400
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Supply Voltage-Max 1.32 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
uPs/uCs/Peripheral ICs Type SoC DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
ECCN Code 3A991
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Address Bus Width
Barrel Shifter NO
Boundary Scan YES
Clock Frequency-Max 300 MHz
External Data Bus Width
Format FIXED POINT
Internal Bus Architecture MULTIPLE
Length 17 mm
Low Power Mode YES
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Terminal Pitch 0.8 mm
Width 17 mm

Compare OMAPL138AZWTA3 with alternatives

Compare MSC7119VM1200 with alternatives