OMAPL138ZCEA3
vs
MSC7119VM1200
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
LEAD FREE, MAPBGA-400
|
Pin Count |
361
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY
|
|
Address Bus Width |
|
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
16
|
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
300 MHz
|
300 MHz
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B361
|
S-PBGA-B400
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
361
|
400
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Supply Voltage-Max |
1.32 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e1
|
Length |
|
17 mm
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.6 mm
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Pitch |
|
0.8 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
17 mm
|
|
|
|
Compare OMAPL138ZCEA3 with alternatives