OMAPL138ZCEA3 vs MSC7119VM1200 feature comparison

OMAPL138ZCEA3 Texas Instruments

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MSC7119VM1200 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, LEAD FREE, MAPBGA-400
Pin Count 361
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY
Address Bus Width
Barrel Shifter NO NO
Bit Size 16
Boundary Scan YES YES
Clock Frequency-Max 300 MHz 300 MHz
External Data Bus Width
Format FLOATING POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B361 S-PBGA-B400
Low Power Mode YES YES
Number of Terminals 361 400
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Max 1.32 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm

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