OMAPL138ZCEA3 vs OMAPL138AZCEA3 feature comparison

OMAPL138ZCEA3 Texas Instruments

Buy Now Datasheet

OMAPL138AZCEA3 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description BGA, 13 X 13 MM, 0.65 MM PITCH, GREEN, PLASTIC, BGA-361
Pin Count 361 361
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY
Address Bus Width
Barrel Shifter NO
Boundary Scan YES
Clock Frequency-Max 300 MHz
External Data Bus Width
Format FLOATING POINT
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B361 S-PBGA-B361
Low Power Mode YES
Number of Terminals 361 361
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER SoC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare OMAPL138ZCEA3 with alternatives

Compare OMAPL138AZCEA3 with alternatives