OR3L165B7BA352-DB
vs
OR4E02-1BMN416I
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-352
|
BGA,
|
| Pin Count |
352
|
416
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MAXIMUM USABLE GATES=244000
|
MAXIMUM NO OF USABLE GATES IS 397000
|
| Combinatorial Delay of a CLB-Max |
1.03 ns
|
1.1 ns
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B416
|
| Length |
35 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
1024
|
624
|
| Number of Equivalent Gates |
120000
|
201000
|
| Number of Inputs |
286
|
|
| Number of Logic Cells |
8192
|
|
| Number of Outputs |
286
|
|
| Number of Terminals |
352
|
416
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1024 CLBS, 120000 GATES
|
624 CLBS, 201000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA352,26X26,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.54 mm
|
2.38 mm
|
| Supply Voltage-Max |
2.625 V
|
1.575 V
|
| Supply Voltage-Min |
2.375 V
|
1.425 V
|
| Supply Voltage-Nom |
2.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
35 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max |
|
420 MHz
|
|
|
|
Compare OR3L165B7BA352-DB with alternatives
Compare OR4E02-1BMN416I with alternatives