P1010NSN5HHB vs P1014NSN5HFA feature comparison

P1010NSN5HHB NXP Semiconductors

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P1014NSN5HFA NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TEBGA-1-425 19 X 19 MM, 1.90 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TEPBGA-425
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 16
Boundary Scan YES YES
External Data Bus Width 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B425 S-PBGA-B425
JESD-609 Code e2 e2
Length 19 mm 19 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 4
Number of External Interrupts 4
Number of Terminals 425 425
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA425,23X23,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.9 mm 1.9 mm
Speed 800 MHz 800 MHz
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 19 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Factory Lead Time 4 Weeks
Bit Size 32
Clock Frequency-Max 100 MHz

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