P1010NSN5HHB
vs
P1014NSN5HFA
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
TEBGA-1-425
|
19 X 19 MM, 1.90 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TEPBGA-425
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
16
|
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B425
|
S-PBGA-B425
|
JESD-609 Code |
e2
|
e2
|
Length |
19 mm
|
19 mm
|
Low Power Mode |
NO
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of DMA Channels |
4
|
|
Number of External Interrupts |
4
|
|
Number of Terminals |
425
|
425
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA425,23X23,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.9 mm
|
1.9 mm
|
Speed |
800 MHz
|
800 MHz
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
2
|
Factory Lead Time |
|
4 Weeks
|
Bit Size |
|
32
|
Clock Frequency-Max |
|
100 MHz
|
|
|
|
Compare P1010NSN5HHB with alternatives
Compare P1014NSN5HFA with alternatives