P1750AE-30QLMB
vs
TSX68C000MF112.5A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP-68
|
QFP,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
2.7 MIPS DAIS MIX; TWO PROGRAMMABLE TIMERS; FAST POLYNOMIAL EXPANSION ALGORITHM
|
|
| Address Bus Width |
16
|
24
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
30 MHz
|
12.5 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-XQFP-F68
|
S-CQFP-G68
|
| Length |
24.26 mm
|
24.13 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.95 mm
|
|
| Speed |
30 MHz
|
12.5 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
24.26 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare P1750AE-30QLMB with alternatives
Compare TSX68C000MF112.5A with alternatives