P2010NSN2MHC
vs
PX4040MN1MMB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
| Package Description |
31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, WB-TEBGA II-689
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
133.3 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B689
|
S-PBGA-B1295
|
| JESD-609 Code |
e2
|
|
| Length |
31 mm
|
37.5 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
689
|
1295
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
2.46 mm
|
3.53 mm
|
| Speed |
1200 MHz
|
1200 MHz
|
| Supply Voltage-Max |
1.1 V
|
1.05 V
|
| Supply Voltage-Min |
1 V
|
0.95 V
|
| Supply Voltage-Nom |
1.05 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
31 mm
|
37.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Temperature Grade |
|
MILITARY
|
|
|
|
Compare P2010NSN2MHC with alternatives
Compare PX4040MN1MMB with alternatives