P5040NSN72QC
vs
P5040NXN12QC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
37.50 X 37.50 MM, 3.53 MMHEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295
|
37.50 X 37.50 MM, 3.53 MMHEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.1
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
166 MHz
|
166 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B1295
|
S-PBGA-B1295
|
| JESD-609 Code |
e1
|
e1
|
| Length |
37.5 mm
|
37.5 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
1295
|
1295
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Seated Height-Max |
3.53 mm
|
3.53 mm
|
| Speed |
2200 MHz
|
2200 MHz
|
| Supply Voltage-Max |
1.23 V
|
1.23 V
|
| Supply Voltage-Min |
1.17 V
|
1.17 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
37.5 mm
|
37.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare P5040NSN72QC with alternatives
Compare P5040NXN12QC with alternatives