P5040NSN72QC
vs
P5040NXN72QC
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
37.50 X 37.50 MM, 3.53 MMHEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295
|
HBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.1
|
3A991.A.1
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Address Bus Width |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
166 MHz
|
166 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B1295
|
S-PBGA-B1295
|
JESD-609 Code |
e1
|
e1
|
Length |
37.5 mm
|
37.5 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
1295
|
1295
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Seated Height-Max |
3.53 mm
|
3.53 mm
|
Speed |
2200 MHz
|
2200 MHz
|
Supply Voltage-Max |
1.23 V
|
1.23 V
|
Supply Voltage-Min |
1.17 V
|
1.17 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
37.5 mm
|
37.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare P5040NSN72QC with alternatives
Compare P5040NXN72QC with alternatives